PCB Assembly
Surface-mount, through-hole, and mixed-technology PCBA for prototype, pre-production, and volume.
Surface-mount, through-hole, and mixed-technology PCBA for prototype, pre-production, and volume.
Box build and mechanical assembly, from bare board to finished, tested system.
Repeatable, documented processes tuned for yield, signal integrity, and thermal reliability.
DFM, DFT, and BOM scrubbing that catches problems on the screen, not the assembly floor.
AOI, functional test, and rework capability, including delicate decap and chip-level repair.
Turn-key sourcing, kitting, and inventory programs across a vetted supplier network.
Every reflow cycle a board survives is a cycle of reliability spent. So we respect the heat-cycle limits component makers actually publish, then build the line to hit it the first time.
That's a 99%+ first-pass yield, with internal rework under 1%. It's the difference between a board that works on the bench and one you can trust in the field.
Why you should care →Every package, footprint, and thermal path reviewed for manufacturability before a single part is placed.
Component sourcing across a vetted network, with real visibility even through the chip-shortage years.
Automated optical inspection and functional test on every build. Defects caught here, not in the field.
One special ingredient sets contract manufacturers apart: care. We ship to spec, on the date we promised.
We track every return (RMA) and every shipment against its promised date. The numbers back the mantra, even through a COVID-hit 2020.
Placement, reflow, and test — tuned so reliability leaves the line with the board. It's the standard behind every assembly we ship: caught up front, not chased at the finish.